• Characteristic and advantage - Remove oxide film, organic material and magnetic Particles through
modules for cleaning process (D/B, R/B, MS,SJ, HPMJ, etc.)
- Remove unwanted contaminated foreign substances present on the
board surface
- CF / TFT and Flexible OLED用 Glass can be cleaned
- It is possible to respond to change in the size of the facility
depending on the type of chemical liquid used in the
process and the size of the substrate
• Range of application
- Deal with glass panel size 2G ~ 8.5G
(over 10G under development)
• Main function
- Cleaning the initial warehousing glass
- Remove any residue of glass before and after each main
process