FOOT PRINT : 1100(W) x 900(D) x 1800(H)
SOLDER BALL SIZE : Min 50㎛
PROCESS
- Chip Loading
- Cyclone(N2)
- Rotate Unit
- Both Side Vision Align (Sub Mask & Chip)
- Solder Ball Attached Chip Unloading
- Vision align, Inspection
CONTROLLER
- PLC Control - Touch Interface
- Error Display By Tester
UPH : 60sec / 1L/F or PCB
POWER : 220V, 1PHASE, 20A, 50/60Hz