MICRO & MINI LED 1 페이지

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  Auto Chip Transferring System (Micro & Mini)

  FOOT PRINT : 2300(W) x 2080(D) x 1700(H)

  EXPANDER-RING LOADER/UNLOADER

      : 2 Cassette M`Z (6Slot)

  WAFER : 8 Inch

  VISION (TOP/BTM) : 8Mega Pixel

  Raw material PCB SIZE (mm) : 1200(W) X 600 (D)

  PROCESS

       - 2Cassette Loading

       - PCB Belt Rail

       - Pin Head Ass`y

  CONTROLLER

       - PC Control    - Touch Interface    - Trouble Shooting Guide

  Capa : 24 Chip /sec (Dual Head)

  POWER : 220V, 1PHASE, 30A, 50/60Hz 

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  Auto Chip Sorting System

  FOOT PRINT : 1,700(W) x 2,200(D) x 2,180(H)

  WAFER-RING LOADER/UNLOADER : 2 Cassette M`Z (6Slot)

  WAFER : 6~8 Inch

  VISION (TOP/BTM) : 25Mega Pixel

  Chip SIZE (mm) : Min 75µm x 75µm

  PROCESS

       - 4 Cassette Loading

       - Vacuum Stage

       - Pin Head Ass`y

  CONTROLLER

       - PC Control    - Trouble Shooting Guide

  Capa : 20 Chip /sec ( 1 Head)

  POWER : 220V, 1PHASE, 20A, 50/60Hz 

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  OS Tester (Micro & Mini LED)

  FOOT PRINT : 2,800(W) x 2,300(D) x 1,900(H)

  GLASS LOADER/UNLOADER : Robot Control

  PCB SIZE (mm) : 1,000mm x 1,000mm

  VISION (TOP/BTM) : 25Mega Pixel

  PROCESS

       - Glass Loading by Robot

       - Vacuum Stage

       - Probe Head Ass`y

  CONTROLLER

       - PC Control    - Trouble Shooting Guide

  Capa : 360 sec / pcb ( 2 Head)

  POWER : 220V, 1PHASE, 30A, 50/60Hz