FOOT PRINT : 1,700(W) x 2,200(D) x 2,180(H)
WAFER-RING LOADER/UNLOADER : 2 Cassette M`Z (6Slot)
WAFER :
6~8 Inch
VISION (TOP/BTM) : 25Mega Pixel
Chip SIZE (mm) : Min 75µm x 75µm
PROCESS
- 4 Cassette Loading
- Vacuum Stage
- Pin Head Ass`y
CONTROLLER
- PC Control - Trouble Shooting Guide
Capa : 20
Chip /sec ( 1 Head)
POWER :
220V, 1PHASE, 20A, 50/60Hz
